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Single-Side Polisher
TAP-400/450/500/600 series
This series of polishing machine comprises double-spindle high-precision single-sided polishing equipment. These machines can be equipped with corresponding polishing heads for different wafers, fix wafers by vacuum adsorption, and pressurize using air bags. The polishing head can rotate and swing. They are suitable for polishing various semiconductor materials.
  • Plate Specifications

    OD400 mm

  • Number of Polishing Heads

    2

  • Polishing Head Swing

    Adjustable Swing & Speed

  • Features
    Drive mode
    Polishing head rotates and swings at meantime
    Pressurizing method
    Vacuum adsorption fixed wafer airbag pressurization
    Constant temperature control
    Temperature control system for polishing plate
    Abundant configurations
    Double spindle processing, equipped with polishing plate conditioner
    Good compatibility
    Different type of polishing heads are available to match different type of wafer
    Pressure calibration
    Precision weighing sensor to monitor downward pressure
    Convenient processing
    The semi-automatic wafer loading and unloading system is optional